Integrated Circuit and Hybrid Circuit Packages

Integrated circuit and hybrid circuit packages; including JEDEC outlines, custom/modified products, glass or ceramic insulators, along with molybdenum or substrate attachment and ground-pin connection options.

Product Summary

Platronics Seals offers a full line of integrated circuit and hybrid circuit packages; including JEDEC outlines, custom/modified products, glass or ceramic insulators, along with molybdenum or substrate attachment and ground-pin connection options.

Discrete transistor packages were supplemented by integrated circuit and hybrid circuit packages in the 1960’s.

To meet this new demand, we developed a line of integrated circuit and hybrid circuit packages, which include flat packs, DIP packages and various TO- configurations. As with other products these packages can be custom plated and can be ordered to meet all applicable specifications.

Applications include integrated circuits, filter networks, hybrid circuits, resistor networks, microwave ICs, sensors and optoelectronics.

Configurations Available:

Flat Packs

Dual-in-Line

Platform

TO-3

TO-5

TO-8

TO-18

TO-39

TO-66

Custom Packages

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