TO-257 Package

Description

Description: JEDEC TO-257 package

Applications: hi-rel power transistors, power electronics, filters, amplifiers, voltage regulators, Mosfets, IGBTs, etc.

Material:  CRS 1020, OFHC copper, Kovar, 52 alloy, Fusite T

Plating: Nickel, Gold over Nickel

Type of seal: glass to metal seals, ceramic to metal seals

Optional substrate choices: Moly, BeO, DBC, AlN, CuW, Glidcop and others