Platronics Seals
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TO-‘s and DO-‘s Hermetic Packages
Hybrid Circuit Packages
Laser Diode and Optoelectronic Packages
Feedthrus and Hermetic Connectors
Ordnance Applications
Window Caps/Lenses
RF Power Transistor Packages
Surface Mount Ceramic Packages and Microwave Device Packages
Custom Designs
Testimonials
Solutions
TO-‘s and DO-‘s Hermetic Packages
All TO- and DO- packages (JEDEC) and variations thereof.
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Hybrid Circuit Packages
Flat packs and not so flat hybrid packages too.
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Laser Diode and Optoelectronic Packages
TO packages, C mounts, butterfly packages, etc.
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Feedthrus and Hermetic Connectors
Any type of dimension and plating.
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Ordnance Applications
Plated, unplated, lapped, ground and not ground.
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Window Caps/Lenses
Different types of glass and sealing technologies.
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RF Power Transistor Packages
Solutions for the wireless world.
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Surface Mount Ceramic Packages and Microwave Device Packages
Solutions with and without leads, many different form factors.
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Custom Designs
With our vast experience we can build almost any type of seal.
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