Description: JEDEC TO-259 package

Applications: hi-rel power transistors, power electronics, filters, amplifiers, voltage regulators, Mosfets, IGBTs, etc.

Material: stainless steel, CRS, OFHC copper, Kovar

Plating: Nickel, Gold, custom

Type of seal: glass to metal seals

Optional substrate choices: Moly, BeO, DBC, AlN, CuW, CuMo, Cu/Mo/Cu and other composites with high thermal conductivity