Description: JEDEC TO-254 package Applications: hi-rel power transistors, high reliability power electronics, filters, hybrid circuits, etc. Material: stainless steel, CRS, OFHC copper, Kovar, Fusite T, 7052 glass Plating: Nickel, Gold over Nickel Type of seal: glass to metal seals, ceramic to metal seals Optional substrate choices: Moly, BeO, DBC, AlN, CuW, Glidcop and others
Description: JEDEC TO-254 package
Applications: hi-rel power transistors, high reliability power electronics, filters, hybrid circuits, etc.
Material: stainless steel, CRS, OFHC copper, Kovar, Fusite T, 7052 glass
Plating: Nickel, Gold over Nickel
Type of seal: glass to metal seals, ceramic to metal seals
Optional substrate choices: Moly, BeO, DBC, AlN, CuW, Glidcop and others
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