Description: JEDEC TO-257 package
Applications: hi-rel power transistors, power electronics, filters, amplifiers, voltage regulators, Mosfets, IGBTs, etc.
Material: CRS 1020, OFHC copper, Kovar, 52 alloy, Fusite T
Plating: Nickel, Gold over Nickel
Type of seal: glass to metal seals, ceramic to metal seals
Optional substrate choices: Moly, BeO, DBC, AlN, CuW, Glidcop and others