TO-254 Package


Description: JEDEC TO-254 package

Applications: hi-rel power transistors, high reliability power electronics, filters, hybrid circuits, etc.

Material: stainless steel, CRS, OFHC copper, Kovar, Fusite T, 7052 glass

Plating: Nickel, Gold over Nickel

Type of seal: glass to metal seals, ceramic to metal seals

Optional substrate choices: Moly, BeO, DBC, AlN, CuW, Glidcop and others