Description: JEDEC TO-259 package
Applications: hi-rel power transistors, power electronics, filters, amplifiers, voltage regulators, Mosfets, IGBTs, etc.
Material: stainless steel, CRS, OFHC copper, Kovar
Plating: Nickel, Gold, custom
Type of seal: glass to metal seals
Optional substrate choices: Moly, BeO, DBC, AlN, CuW, CuMo, Cu/Mo/Cu and other composites with high thermal conductivity